feat: KT mBMS 펌웨어 3종(HW1/2/3) 및 통합 빌드 환경 초기 커밋 (V4.0.0.1)

mBMS_APP_V3117/APP/temp.h

@@ -0,0 +1,51 @@
+/*
+*********************************************************************************************************
+*
+*                                      APPLICATION CONFIGURATION 
+*
+*                                     ST Microelectronics STM32 
+*                                              with the 
+*                                      BMCU for AMO LFP 380-100 
+*
+* Filename      : adc.h 
+* Version       : V1.00 
+* Programmer(s) : JK.Woo
+*********************************************************************************************************
+*/
+
+#ifndef _TEMP_H_
+#define _TEMP_H_
+
+#include <stm32f4xx.h>
+
+#define AD_NORMAL           0x0000
+#define AD_DISABLE          0x0000
+#define AD_FAIL             0x0001
+#define AD_HIGH             0x0002
+#define AD_LOW              0x0003
+
+u16 ReadAdc(u8 adc_input);
+void SetAdc(u8 adc_input);
+u16 GetAdc(void);
+
+void AdcInit(void);
+void ADC_Process(void);
+
+void ADC_Param_Load(void);
+s16 CalcThermistor(s16 iADC_value);
+float ADValueF(u8 ch);
+
+s16 CalcTemperatureST32(u16 volt);
+
+s16 ADValue(u8 ch);
+u16 ADState(u8 ch);
+
+void AppTaskTempAdc(void);
+
+s16 GetCpuTemp(void);
+
+void ODisplayAdcStatus(u8 p);
+
+u8 IsTempSensorFailed(void);
+
+#endif